TTM Offers Critical PCB Technologies to Support Data Center Computing Applications
More Capabilities to Support Advanced Data Center Computing
In addition to the above, TTM provides full lifecycle support and broad offerings of printed circuit board, RF/microwave, and engineered solutions. Other examples of capabilities we offer to support our advanced data center computing customers include:
- Ultra-high aspect ratio
- Via fill
- 50+ layers
- Seamless transfer from prototype to volume production
- Advanced Materials and Process for high-speed Performance
- Quick turns
Locations that Support Your Innovative Applications
- HDI
- Highly Automated Production Lines
- Multi-layered Printed Circuit Board
- Greenfield Facility
- High-layer count designs
- Laser microvias
- Advanced materials
- High-volume 2.0 core material