TTM Offers Critical PCB Technologies to Support Computing Applications
![Backdrilling](/sites/default/files/styles/max_325x325/public/2020-10/bullet_Backdrilling.jpg?itok=O3Zd4own)
![Large Format Backplane](/sites/default/files/styles/max_325x325/public/2020-10/bullet_Large_Format_Backplane1.jpg?itok=we-3y6ps)
![High Speed Backplane](/sites/default/files/styles/max_325x325/public/2020-10/bullet_High_%20Speed_Backplane.jpg?itok=xGMhckZU)
![HDI](/sites/default/files/styles/max_325x325/public/2021-03/bullet_HDI.jpg?itok=mMm-YR3_)
![Backplane Integration Line](/sites/default/files/styles/max_325x325/public/2020-10/bullet_Backplane_Integration_Line.jpg?itok=2ZVB7Fy8)
![Kelvin Test](/sites/default/files/styles/max_325x325/public/2021-03/bullet_kelvintest.jpg?itok=d_zveIJp)
More Capabilities to Support Advanced Computing
In addition to the above, TTM provides full lifecycle support and broad offerings of printed circuit board, RF/microwave, and engineered solutions for our customers in both commercial and non-commercial industries. Other examples of capabilities we offer to support our high-end computing customers include:
- Lead-free manufacturing
- Ultra-high aspect ratio
- Via fill
- 50+ layers
- RF and Specialty components
- Seamless transfer from prototype to volume production
Locations that Support Your Innovative Applications
![OPCM](/sites/default/files/styles/max_325x325/public/2020-10/bullet_OPCM.jpg?itok=uDHtiUw0)
- HDI
- Sequential
- Hybrid structures
- Multiple surface finishes
![Chippewa Falls Plant](/sites/default/files/styles/max_325x325/public/2020-10/bullet_CF_Plant.jpg?itok=90-8VeQP)
- High-layer count designs
- Laser microvias
- Advanced materials
- High-volume 2.0 core material