TTM Offers Critical PCB Technologies to Support Data Center Computing Applications
More Capabilities to Support Advanced Data Center Computing
In addition to the above, TTM provides full lifecycle support and broad offerings of printed circuit board, RF/microwave, and engineered solutions. Other examples of capabilities we offer to support our advanced data center computing customers include:
- Ultra-high aspect ratio
- Via fill
- 50+ layers
- Seamless transfer from prototype to volume production
- Advanced Materials and Process for high-speed Performance
- Quick turns
Locations that Support Your Innovative Applications
TTM Dongguan ("DMC") was established in 2001 and is best suited for advanced technology multi-layer PCB in volume.
- High layer count
- Conventional
- Hybrid & sequential structure
- HDI
TTM Guangzhou ("GZ") is best suited for advanced technology multi-layer PCB in volume application.
- High layer count
- Conventional and advanced HDI
- Oversized line card and backplanes
- Hybrid & sequential structures
- Thermal management
TTM Penang ("PNG") is our highly advanced technology-equipped facility in Southeast Asia.
- HDI
- Highly Automated Production Lines
- Multi-layered Printed Circuit Board
- Greenfield Facility
TTM Toronto ("TOR") delivers quick-turn and ramps to low- and mid-volume under one roof.
- Quick-turn, high-mix, low- to mid-volume
- Radar and LiDAR development
- Material development; polyphenylene oxide ("PPO"), teflon
- Flex, rigid-flex
- Advanced HDI, including 3+n+3
- High layer count requiring high-performance materials, controlled impedance, back-drilling, high aspect ratio plating, VIPPO, etc.
- Seamless transfer to volume production in Asia
- Diverse laminate materials from North America and Asia Pacific