Skip to main content
Markets We Serve

Networking & Communications Capabilities

Industry-leading, Advanced PCB and Technology Solutions for Telecommunications & Networking Applications.

TTM’s Leading-Edge Capabilities Deliver Reliable Advanced Technology Solutions

We are recognized as an industry-leading provider of advanced technology PCB product solutions across the networking market. Our key telecommunications manufacturing facilities provide customers with the highest levels of technology and quality, designed to support emerging optical data rates up to 3.2T and beyond.

TTM has expertise in Radio Frequency & Specialty ("RF&S") components, engineered thermal solutions, and advanced photonics packaging that set us apart from other PCB manufacturers. Our value goes beyond PCB and offers an integrated, complete solution to support your full product lifecycle.

TTM has a number of solutions and broad expertise for Networking applications

Conventional PCBs
Advanced PCBs utilize cutting-edge drilling and plating technology to support high layer counts and complex designs, meeting the demands of next-generation electronics. Find out more about our PCB offerings.
RF/Microwave PCB
All cellular devices require a network of base stations to function. The base station antennas transmit and receive RF signals, or radio waves, to and from mobile phones near the base station.
Data Center & Computing-Capabilities-04-HDI
HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products.
Xingers
TTM manufactures a range of passive components used extensively in cellular base stations and tower mounted hardware. These products are critical signal path products that allow our customers the highest levels of performance while keeping costs down. We also offer expertise in advanced photonics packaging, engineered thermal solutions, and integrated RF solutions. Our teams have deep expertise in this area and we continue to offer differentiated products that support our innovative customer-base.

Networking Capabilities

TTM Continually Invests in Capital and Talent to Meet the Needs of Networking Industries

Chippewa Falls Plant

TTM Chippewa Falls ("CF") is a leader in advanced high technology PCBs for use in volume applications.

  • High layer count
  • Laser microvias
  • Advanced materials
  • High volume 2.0 core material
DMC

TTM Dongguan ("DMC") was established in 2001 and is best suited for advanced technology multi-layer PCB in volume.

  • High layer count
  • Conventional
  • Hybrid & sequential structure
  • HDI
GZ Plant

TTM Guangzhou ("GZ") is best suited for advanced technology multi-layer PCB in volume application.

  • High layer count
  • Conventional and advanced HDI
  • Oversized line card and backplanes 
  • Hybrid & sequential structures
  • Thermal management

 

Relevant Pages

Relevant Pages

Networking & Communications

Discover More

Networking Applications

Discover More

5G/6G

Discover More

RF and Specialty Components

Discover More

Have Questions? We Have Answers.

Our key telecommunications manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.

Contact us today to get started with a complete solution supplier. 

Connect with Us