TTM’s Leading-Edge Capabilities Deliver Reliable Advanced Technology Solutions
We are recognized as an industry-leading provider of advanced technology PCB product solutions across the telecommunications & networking market. Our key telecommunications manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.
TTM has expertise in RF and specialty components, engineered thermal solutions, and advanced photonics packaging that set us apart from other PCB manufacturers. Our value goes beyond PCB and offers an integrated, complete solution to support your full product lifecycle.
TTM has a number of solutions and broad expertise for Networking and Telecommunications applications
General Networking & Communications Capabilities
TTM Continually Invests in Capital and Talent to Meet the Needs of Networking & Communications Industries
TTM Chippewa Falls (CF) is a leader in advanced high technology PCBs for use in volume applications.
- High layer count
- Laser microvias
- Advanced materials
- High volume 2.0 core material
TTM Dongguan (DMC) was established in 2001 and is best suited for advanced technology multi-layer PCB in volume.
- High layer count
- Conventional
- Hybrid & sequential structure
- HDI
TTM Guangzhou (GZ) is best suited for advanced technology multi-layer PCB in volume application.
- High layer count
- Conventional and advanced HDI
- Oversized line card and backplanes
- Hybrid & sequential structures
- Thermal management