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TTM Tech Academy

On-Demand Resources

TTM Tech Academy is an Educational Resource Hub for Technology Professionals.

On-Demand Resources from
TTM Tech Academy

Brought to you by TTM's global network of engineers, our resources cover a range of topics. These resources will enhance your understanding of emerging technology trends. TTM Tech Academy's subject matter experts provide you with the knowledge you need to engage with your PCB and electronic component suppliers at a deeper level. These resources will help you achieve improved results for your applications and ultimately your customers.

Webinar Recordings

TTM’s global team of engineers has created a series of webinars to provide insight and best practices regarding PCB and RF components manufacturing, as well as emerging technology trends. Sign up for our newsletter to stay tuned for more recorded and live sessions from our subject matter experts.

Webinar
Top 10 Things Everyone Wants to Know about Rigid-Flex PCB Tech
On-Demand
Webinar
A Critical Analysis of CAF Testing - Temperature, Humidity, and the Reality of Field Performance
On-Demand
Webinar
High-Density Interconnect (HDI) Technology (Mandarin)
On-Demand
Webinar
Impedance Control & Stack-Ups (English)
On-Demand
Webinar
Managing Heat with Engineered Thermal Solutions (HDVP/ETS) (English)
On-Demand
Webinar
Next Generation RF/mmWave PCB Manufacturing & Architecture (English)
On-Demand
Webinar
High-Density Interconnect (HDI) Technology (English)
On-Demand
Webinar
High-Speed Backplane Design & Manufacturing Techniques (English)
On-Demand
Webinar
PCB 101: An Introduction to Printed Circuit Board Technology (English)
On-Demand
Webinar
PCB 101: An Introduction to Printed Circuit Board Technology (Mandarin)
On-Demand
Webinar
Cost Drivers in Printed Circuit Board (PCB) Manufacturing (English)
On-Demand
Webinar
PCB Fabrication Variables Impacting Signal Integrity (English)
On-Demand
Webinar
Surface Finishes (English)
On-Demand
Webinar
CAF: Conductive Anodic Filament (English)
On-Demand

eBooks

5 Essential PCB Design Best Practices

2017

5G Challenges for PCB Fabrication

2019

Rigid-Flex Technology & Applications

2019

TTM Digest – Monthly Newsletter

Digest issue
Editorial Topics
Link
May-22
New TTM Tech Academy webinars added – Register Today!
Apr-22
TTM Technologies Q1, 22’ Result released and many more….
Mar-22
Get connected in the post-pandemic world!
Feb-22
Driving towards a Healthier Future with Expanding Footprint!
Jan-22
TTM starts 2022 with exciting news!
Dec-21
Latest TechMinute Released, and Happy New Year!
Nov-21
Staying Safe, and moving forward to 2022
Oct-21
mmWave
Sep-21
Advanced Driver Assistance Systems (ADAS)
Aug-21
Printed Circuit Board (PCB)
Jul-21
5G
Jun-21
Telecom Infrastructure
May-21
Test & Measurement

TTM TECHMINUTE

Gavin Hung - Field Applications Engineering Manager - AMI&I BU

- How to bend the cores together? (Mandarin with English subtitles)

Tom Buck - Project Manager, RF Technology

- What is your advice for someone building a reference design for RF/mmWave or Microwave PCBs?

Andy Cameron - Field Applications Engineering Manager

- How oxide processes can impact insertion loss?

Randy Mattsen - Senior Field Applications Engineer

- What properties are the most important when selecting PCB materials?

Nick Koop - Director of Flex Technology

- What is the maximum copper density spec for flex construction?