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TTM Tech Academy

On-Demand Resources

TTM Tech Academy is an Educational Resource Hub for Technology Professionals.

On-Demand Resources from
TTM Tech Academy

Brought to you by TTM's global network of engineers, our resources cover a range of topics. These resources will enhance your understanding of emerging technology trends. TTM Tech Academy's subject matter experts provide you with the knowledge you need to engage with your PCB and electronic component suppliers at a deeper level. These resources will help you achieve improved results for your applications and ultimately your customers.

Webinar Recordings

TTM’s global team of engineers has created a series of webinars to provide insight and best practices regarding PCB and RF components manufacturing, as well as emerging technology trends. Sign up for our newsletter to stay tuned for more recorded and live sessions from our subject matter experts.

Latest Webinar Recordings

How to Apply DFM Rules to Different Stack-up Constructions

Discover different stack-up scenarios of increasing complexity, highlighting the key trade-offs for each, and much more...

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Other Webinar Recordings

ON-DEMAND RESOURCES
High-speed Materials (in English)
July 2025
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ON-DEMAND RESOURCES
High-speed Materials (in Mandarin)
July 2025
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ON-DEMAND RESOURCES
Bridging Telecom and Mil-Aero: Smarter RF Solutions for a Connected Future
Jun 2025
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ON-DEMAND RESOURCES
PCB 101 (in English)
May, 2025
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ON-DEMAND RESOURCES
PCB 101 (in Mandarin)
May, 2025
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ON-DEMAND RESOURCES
Cost Consideration
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On-Demand Resources
Artificial Intelligence – Design and Manufacturing Opportunities and Challenges in the PCB Industry
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ON-DEMAND RESOURCES
PCB Manufacturing from A-Z
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On-Demand Resources
Impedance Control and Stack-ups Fundamentals
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ON-DEMAND RESOURCES
Optimization and Recommendations on Implementing TTM RF&S Xinger RF Passive Components in all Applications
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ON-DEMAND RESOURCES
PCB Design for Manufacturing: Cost Considerations (English)
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ON-DEMAND RESOURCES
Rigid-Flex 101
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eBooks

5 Essential PCB Design Best Practices

2017

5G Challenges for PCB Fabrication

2019

Rigid-Flex Technology & Applications

2019

TTM Digest – Monthly Newsletter

Digest issue
Editorial Topics
Link
Sep-25
Mastering PCB Design
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Aug-25
Inspiring Healthcare Innovation
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Jul-25
TTM Prepares for the Future with the Acquisition of a Facility in Wisconsin and Land in Penang, and more exciting news…
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Jun-25
RF&S Advancements for Enhanced Military Capabilities
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May-25
TTM Technologies Q1 2025 results released and more…
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Mar-25
Transforming Transportation
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Feb-25
The Critical Role of PCBs in Driving AI Technology Forward
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Jan-25
Wishing you a successful 2025!
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Dec-24
Happy Holidays from TTM!
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Nov-24
Driving Innovation: TTM Technologies' Role in the Future of Automotive Smart Antennas
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Oct-24
Join Our Upcoming TTM Tech Academy Webinars!
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Sep-24
Discover PCB Innovations with TTM Technologies
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Subscribe to our corporate newsletter, "TTM Digest", for the latest industry news, trending topics, and market insights sent to your inbox monthly.
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TTM TECHMINUTE

Kelter Lee - Principal Field Application Engineer

Ep 15 - What are the differences between Laser Direct Imaging (“LDI”) and Direct Imaging (“DI”) in soldermask application
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Richard Dang - Field Application Engineer

Ep 14 - What's the limit on stacked micro-vias?
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Richard Dang - Field Application Engineer

Ep 13 - How do you verify the trace impedance?
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Richard Dang - Field Application Engineer

Ep 12 - How can you work with the PCB manufacturer to reduce the soldermask thickness on PCBs?
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Richard Dang - Field Application Engineer

Ep 11 - Is there any cost impact between via plug vs soldermask open?
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Richard Dang - Field Application Engineer

Ep 10 - Regarding Via Tenting, what if the mask is "partially" over the via pad, leaving the hole open?
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Richard Dang - Field Application Engineer

Ep 9 - Can you compare the cost of Edge Plating vs Edge Pinning Vias?
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Mark Bowyer -Director, Business Development - RF&S

Ep 8 - How are the introduced data or components different from the available market solutions?
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Gavin Hung - Field Applications Engineering Manager - AMI&I BU

Ep 7 - To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)
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Gavin Hung - Field Applications Engineering Manager - AMI&I BU

Ep 6 - Can we directly replace laser vias with backdrills? (Mandarin with English subtitles)
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Gavin Hung - Field Applications Engineering Manager - AMI&I BU

Ep 5 - How to bend the cores together? (Mandarin with English subtitles)
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Tom Buck - Project Manager, RF Technology

Ep 4 - What is your advice for someone building a reference design for RF/mmWave or Microwave PCBs?
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Andy Cameron - Field Applications Engineering Manager

Ep 3 - How oxide processes can impact insertion loss?

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Randy Mattsen - Senior Field Applications Engineer

Ep 2 - What properties are the most important when selecting PCB materials?

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Nick Koop - Director of Flex Technology

Ep 1 - What is the maximum copper density spec for flex construction?

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Expert_Winnie Ng
Winnie Ng
Vice President, Corporate Marketing