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TTM Tech Academy

On-Demand Resources

TTM Tech Academy is an Educational Resource Hub for Technology Professionals.

On-Demand Resources from
TTM Tech Academy

Brought to you by TTM's global network of engineers, our resources cover a range of topics. These resources will enhance your understanding of emerging technology trends. TTM Tech Academy's subject matter experts provide you with the knowledge you need to engage with your PCB and electronic component suppliers at a deeper level. These resources will help you achieve improved results for your applications and ultimately your customers.

Other Webinar Recordings

Webinar
Impedance Control and Stack-ups Fundamentals
On-Demand
Webinar
Webinar PCB Design for Manufacturing: Cost Considerations
On-Demand

eBooks

5 Essential PCB Design Best Practices

2017

5G Challenges for PCB Fabrication

2019

Rigid-Flex Technology & Applications

2019

TTM Digest – Monthly Newsletter

Digest issue
Editorial Topics
Link
Mar-25
Transforming Transportation
Feb-25
The Critical Role of PCBs in Driving AI Technology Forward
Jan-25
Wishing you a successful 2025!
Dec-24
Happy Holidays from TTM!
Nov-24
Driving Innovation: TTM Technologies' Role in the Future of Automotive Smart Antennas
Oct-24
Join Our Upcoming TTM Tech Academy Webinars!
Sep-24
Discover PCB Innovations with TTM Technologies
Aug-24
Bringing 5G/5.5G Applications to Life
SUMMER-24
TM Technologies Q2, 2024 Results released and more…
May-24
Enhancing Healthcare through Advanced PCB Technology
Apr-24
TTM Technologies Q1 2024 results released and more…
Mar-24
TTM Penang is officially open and more…

TTM TECHMINUTE

Richard Dang - Field Application Engineer

Ep 12 - How can you work with the fab house to reduce the solder mask thickness on PCBs?

Richard Dang - Field Application Engineer

Ep 11 - is there any cost impact between via plug vs soldermask open?

Richard Dang - Field Application Engineer

Ep 10 - Regarding Via Tenting, what if the mask is "partially" over the via pad, leaving the hole open?

Richard Dang - Field Application Engineer

Ep 9 - Can you compare the cost of Edge Plating vs Edge Pinning Vias?

Mark Bowyer -Director, Business Development - RF&S

Ep 8 - How are the introduced data or components different from the available market solutions?

Gavin Hung - Field Applications Engineering Manager - AMI&I BU

Ep 7 - To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)

Gavin Hung - Field Applications Engineering Manager - AMI&I BU

Ep 6 - Can we directly replace laser vias with backdrills? (Mandarin with English subtitles)

Gavin Hung - Field Applications Engineering Manager - AMI&I BU

Ep 5 - How to bend the cores together? (Mandarin with English subtitles)

Tom Buck - Project Manager, RF Technology

Ep 4 - What is your advice for someone building a reference design for RF/mmWave or Microwave PCBs?

Andy Cameron - Field Applications Engineering Manager

Ep 3 - How oxide processes can impact insertion loss?

Randy Mattsen - Senior Field Applications Engineer

Ep 2 - What properties are the most important when selecting PCB materials?

Nick Koop - Director of Flex Technology

Ep 1 - What is the maximum copper density spec for flex construction?