High-Density Interconnect (HDI) PCB

HDI PCBs capitalize on the latest technologies available to increase the functionality, enabling the use of finer pitch and improving PCB signal integrity using the same or less area. This advancement in PCB technology supports advanced features in revolutionary new products, including 5G communications, networking equipment, IoT, wearables for medical patient monitoring, PCBs for autonomous applications, LiDAR systems, vehicle-to-everything (“V2X”) communications, and military applications such as satellites, avionics, and intelligent munitions.

A laser-drilled microvia has a drilled diameter as small as 0.004" (100µm), which is optically aligned in a pad diameter as small as 0.008" (200µm), allowing additional routing density. Microvias can be via-in-pad (for direct component mounting), offset, staggered or stacked, non-conductive filled, and copper-plated over the top or solid copper filled or plated. Microvias add values when routing out of fine pitch BGA such as 0.8 mm pitch devices and below.

Additionally, microvias add values when routing out of a 0.5 mm pitch device where staggered microvias can be used. However, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device requires stacked microvias using an inverted pyramid routing technique.

TTM has years of experience with HDI products and was a pioneer of second-generation microvias or stacked microvias. Stacked microvia technology with solid copper stacked microvias enables rout-out solutions for very high speed and micro BGA.

TTM offers an entire family of microvia technology solutions for your next-generation products.

TTM developed and now offers third generation microvias or NextGen-SMV®, which offers stacked microvia fabrication on time (5-7 days). NextGen-SMV® technology allows for a quick turn of PCB designs with complex via structures. It requires only one lamination cycle reducing thermal excursions (thermal degrading of material) and cycle time.

NextGen-SMV® eliminates the copper plating cycle of inner layers, improving impedance tolerance, reducing overall thickness, and improving electrical characteristics. Additionally, NextGen-SMV® provides designer flexibility to have any-layer-via connectivity using a metallurgical bond between conductive paste and copper on the inner layers. SMV® technology can also be utilized with NextGen-SMV for the surface or external microvias to create a solid copper via if required.

Additionally, NextGen Sub-Link Technology® allows the interconnecting of multiple subs containing high technology or standard technology. This technology allows the use of high-performance materials only where they are needed or required.

It's the solution for networking, high-end server, telecommunications, military, and medical markets – anyplace where speed, reliability, and increased signal I/O must combine with reduced size, weight, and power ("SWaP").

• 25 microns line and space
• RAD tolerant
• High-speed

Find out more about substrate-like PCB.

CoreEZ® semiconductor packaging uses the HyperBGA® manufacturing platform. It is an excellent choice for applications requiring low-cost build-up materials and high reliability, performance, and wireability.

• 28 microns line and space
• RAD Hard
• Tight registration build-up technology

Find out more about substrate-like PCB.