Medical Capabilities

TTM manufactures a variety of standard high-frequency, high-power RF, and high-reliability resistors and custom high-reliability chip resistors used extensively in medical and mission-critical applications. Our broad product offering comes in various formats, including chip, SMD, flanged, and unflanged. Thanks to beryllium-oxide ("BeO") and aluminum nitride ("AIN") ceramic construction, we can provide the high-power handling needs while maintaining reliability and excellent performance.

•    Ceramic base material: aluminum oxide ("Al203"), beryllium oxide ("BeO"), aluminum nitride ("AIN")
•    Termination styles: surface mount, flip chip, single-edge metalizing for high-performance terminations, wire bondable, leaded
•    Termination materials: Pd/Ag, Pt/Au, Au, Ag, Ni, plated: Sn over Ni, Sn/Pb over Ni, ENiG
•    Values: 50 milli-ohms-100 giga-ohms, tolerances To +/- 0.5%, TCR to +/-50 PPM/C
•    Size: wire bondable to 0.020” X 0.020” (0505), surface-mounted to 0.020” X 0.010” (0502)

 

TTM’s family of high-reliability chip resistors, high-frequency QPL resistors, and high-voltage resistors as small as 0.5x0.2x0.1mm (metric case size 0502) are designed for a wide range of mission-critical instrumentation applications, including plasma generators, MRI equipment, bedside medical devices, mass spectrometers, high-voltage power supplies, and many more.

Medical devices require high-reliability in order to ensure patient safety while minimizing risk. Our rich heritage of engineering expertise allows us to provide ideal solutions for medical devices. Our precision technologies enable us to deliver high-performance and high-reliability substrates for automated external defibrillators ("AED") and hearing aids, as well as implantable devices such as pacemakers.

•    Base material: aluminum oxide ("Al203"), beryllium oxide ("BeO"), aluminum nitride ("AIN")
•    Specifications: VSWR rated at 1.25:1 or better to 6 GHz, 50/100 Ohms +/- 2% standard
•    Resistor styles: surface-mounted, coaxial, top contact (chip), leaded (with or without flange carrier)
•    Termination materials: Pd/Ag, Pt/Au, Au, Ag, Ni barrier
•    Microwave attenuators: stripline, surface-mounted

 

TTM Huiyang ("HY") is specializes in quick-turn, low-to-mid-volume production, with a specific focus on medium-to-high-technology products.

• High-Density Interconnect (type 1, 2,3)
• Radar
• Hybrid
• Flat wrap
• Copper fill
• No conductive fill
• VIPPO
• Backdrill
• LDI
• Optical routing
• ENEPIG
• Edge plating
• TMS
• IST and capacitance

TTM Logan ("LG") focuses on high-mix, low-volume production.

• 2 – 64 layers / 5~450mil thickness

TTM Toronto ("TOR") delivers quick-turn and ramps to low- and mid-volume under one roof.

• Quick-turn, high-mix, low- to mid-volume
• Radar and LiDAR development
• Material development; polyphenylene oxide ("PPO"), teflon
• Flex, rigid-flex
• Advanced HDI, including 3+n+3
• High layer count requiring high-performance materials, controlled impedance, back-drilling, high aspect ratio plating, VIPPO, etc.
• Seamless transfer to volume production in Asia
• Diverse laminate materials from North America and Asia Pacific

TTM Zhongshan ("ZS") specializes in high-volume automotive quality and reliability products.

• High reliable PCBs, advantages in heavy copper with a maximum of 16oz
• Total solution for PCBs in thermal management
• Mid to high layer multi-layer rigid PCB (up to 30 layers)
• HDI product and Specialty product for Radar applications with low-loss material