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Markets We Serve

Automotive Capabilities

TTM Continues to Invest to Meet the Needs of the Automotive Market.

A Proven Track Record for High-Reliability Product & Customer Service Excellence

For over two decades, TTM has provided a broad range of capabilities to the automotive market. We have evolved our product portfolio and global engineering talent as the industry has changed and seen disruption with the introduction of exciting new technologies that make vehicles smarter, more efficient, and safer.


TTM has TS 16949 certified sites in North America and Asia Pacific.

 

Volume Production Capabilities

Seamless Transfer from Prototype to Volume Production with TTM

Reduced risk, faster time-to-market, and the superior quality the automotive industry expects from TTM.

TTM's global network of printed circuit board manufacturing facilities, R&D centers, and mmWave solutions teams mitigates our customers' risk. We have developed strategies that provide our customers with efficient, streamlined approaches to help their products move seamlessly from one stage of the lifecycle to another. These processes aid in the consistent outcomes that high-reliability applications depend on in the field.

Critical benefits of TTM's seamless transfer strategy and full lifecycle support:

  • Streamlined quoting including one-time NRE / test charges
  • Data transfer packages including "best practices" for manufacturing
  • Common / in-parallel stack-ups and DFM reviews
  • Efficient technical query ("TQ") process
  • Common materials for both standard FR4 and high-speed
  • Global customer profiles
  • Global TQ waiver forms

Ultra Quick-Turn & Quick-Turn Capabilities in North America

bullet_GZPlant

TTM Guangzhou ("GZ") is best suited for advanced technology multi-layer PCB in volume application.

  • High layer count
  • Conventional and advanced HDI
  • Oversized line card and backplanes 
  • Hybrid & sequential structures
  • Thermal management
     
bullet_SJPlant

TTM San Jose ("SJ") is a leader in Ultra-Fast Quick-turn PCBs on Advanced High-Density Interconnect Product.

  • Ultra quick-turn, high-mix, low volume
  • Radar with hybrid materials, tight etching, plating controls
  • LiDAR utilizing vision drilling and routing
  • High layer count requiring high-performance materials, controlled impedance, back-drilling, VIPPO, etc.
  • Seamless transfer to Asia volume production
  • Diverse laminate materials
TOR Plant

TTM Toronto ("TOR") delivers quick-turn and ramps to low- and mid-volume under one roof.

  • Quick-turn, high-mix, low- to mid-volume
  • Radar and LiDAR development
  • Material development; polyphenylene oxide ("PPO"), teflon
  • Flex, rigid-flex
  • Advanced HDI, including 3+n+3
  • High layer count requiring high-performance materials, controlled impedance, back-drilling, high aspect ratio plating, VIPPO, etc.
  • Seamless transfer to volume production in Asia
  • Diverse laminate materials from North America and Asia Pacific

 

bullet_ZSPlant

TTM Zhongshan ("ZS") specializes in high-volume automotive quality and reliability products.

  • High reliable PCBs, advantages in heavy copper with a maximum of 16oz
  • Total solution for PCBs in thermal management
  • Mid to high layer multi-layer rigid PCB (up to 30 layers)
  • HDI product and Specialty product for Radar applications with low-loss material

Related Resources

Brochure
Semi-Flex Printed Circuit Technology
2026
Brochure
High-Density Interconnect Technology Overview
2026
Brochure
Automotive Overview
2026
Brochure
Automotive Thermal Management Solutions
2026

Relevant Pages

Relevant Pages

Automotive

Automotive Applications

Solutions

High-Density Interconnect ("HDI") PCB

Flex/ Rigid-Flex PCB

Thermal Management

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