On-Demand Resources from
TTM Tech Academy
Brought to you by TTM's global network of engineers, our resources cover a range of topics. These resources will enhance your understanding of emerging technology trends. TTM Tech Academy's subject matter experts provide you with the knowledge you need to engage with your PCB and electronic component suppliers at a deeper level. These resources will help you achieve improved results for your applications and ultimately your customers.
Other Webinar Recordings
eBooks
Digest issue
Editorial Topics
Link
Nov-24
Driving Innovation: TTM Technologies' Role in the Future of Automotive Smart Antennas
Subscribe to our corporate newsletter, "TTM Digest", for the latest industry news, trending topics, and market insights sent to your inbox monthly.
TTM TECHMINUTE
Richard Dang - Field Application Engineer
- Can you compare the cost of Edge Plating vs Edge Pinning Vias?
Mark Bowyer -Director, Business Development - RF&S
- How are the introduced data or components different from the available market solutions?
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
- To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
- How to bend the cores together? (Mandarin with English subtitles)
Tom Buck - Project Manager, RF Technology
- What is your advice for someone building a reference design for RF/mmWave or Microwave PCBs?
Andy Cameron - Field Applications Engineering Manager
- How oxide processes can impact insertion loss?
Randy Mattsen - Senior Field Applications Engineer
- What properties are the most important when selecting PCB materials?
Nick Koop - Director of Flex Technology
- What is the maximum copper density spec for flex construction?
More Resources from TTM Tech Academy
Discover more ways to learn and be part of our global community of technology professionals.