提供进阶医疗技术的能力
明智的印刷电路板制造方案：
帮助我们的客户更快地将可靠的应用推向市场。
电阻和陶瓷元件
• 陶瓷基材：三氧化二铝（Al2O3）、氧化铍基板（BeO）、氮化铝（AIN）
• 端接样式：表面安装、倒装芯片、用于高性能端接的单边金属化、引线键合、引线
• 端接材料：Pd / Ag、Pt / Au、Au、Ag、Ni、电镀：Ni上的Sn、Ni上的Sn / Pb、ENiG
• 值：50毫欧-100千兆欧，公差为+/- 0.5％，电阻温度系数（TCR）为+/- 50 PPM / C
• 尺寸：可焊至0.020” X 0.020”（0505）的导线，表面安装至0.020” X 0.010”（0502）
• 基础材料：氮化铝、三氧化二铝（Al2O3）、氧化铍基板（BeO）
• 规格：电压驻波比（VSWR）额定值为1.25：1或更高，或达至6 GHz，50/100 Ohms +/- 2％标准
• 电阻类型：表面安装、同轴、顶部触点（芯片）、引线（带凸缘式和非带凸缘式支架）
• 终端材料：Pd / Ag、Pt / Au、Au、Ag、Ni阻挡层
• 微波衰减器：带状线、表面安装
Plant Capabilities in TTM
TTM Huiyang ("HY") is specializes in quick-turn, low-to-mid-volume production, with a specific focus on medium-to-high-technology products.
- High-Density Interconnect (type 1, 2,3)
- Radar
- Hybrid
- Flat wrap
- Copper fill
- No conductive fill
- VIPPO
- Backdrill
- LDI
- Optical routing
- ENEPIG
- Edge plating
- TMS
- IST and capacitance
TTM Toronto ("TOR") delivers quick-turn and ramps to low- and mid-volume under one roof.
- Quick-turn, high-mix, low- to mid-volume
- Radar and LiDAR development
- Material development; polyphenylene oxide ("PPO"), teflon
- Flex, rigid-flex
- Advanced HDI, including 3+n+3
- High layer count requiring high-performance materials, controlled impedance, back-drilling, high aspect ratio plating, VIPPO, etc.
- Seamless transfer to volume production in Asia
- Diverse laminate materials from North America and Asia Pacific
TTM Zhongshan ("ZS") specializes in high-volume automotive quality and reliability products.
- High reliable PCBs, advantages in heavy copper with a maximum of 16oz
- Total solution for PCBs in thermal management
- Mid to high layer multi-layer rigid PCB (up to 30 layers)
- HDI product and Specialty product for Radar applications with low-loss material
