Project Diamond: Advancing PCB Technology for Defense and National Security

TTM Technologies is proud to support the mission-critical needs of our defense customers with Project Diamond. Why Diamond? Because inside, we make hard things! Project Diamond describes our new, state-of-the-art manufacturing facility being built in Central New York. It is designed to meet the growing demand for advanced printed circuit board (PCB) functionality in smaller, more efficient packages.

By utilizing technology initially developed for smartphones and consumer electronics, Diamond brings commercial innovation to the defense industry, enabling next-generation systems that enhance warfighter capabilities and safeguard national security. This domestic manufacturing bolsters supply chain resilience and ensures the reliable production of ultra-high-density interconnect PCBs essential for defense applications.

Spanning 215,000 square feet—with 100,000 square feet reserved for future expansion—this facility represents a bold investment in the future of advanced manufacturing. It will deliver the precision, reliability, and sophistication needed to power the most demanding defense systems.

Progress on Project Diamond has been remarkable. Foundations, partial roofing and elevator shafts were completed in 2024. In February of 2025, the steel erection phase will be completed, and the focus will shift to pouring concrete—critical for the interior buildout and equipment installation. Despite some challenges with winter weather, the Project continues to progress.

Diamond is more than a facility; it will be a vibrant home for dedicated professionals equipped with advanced processes and technology, all driven by a commitment to innovation and national security in support of those who protect us.