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Thick Film Substrates

TTM is an Industry-Leading Innovator of High-Quality Ceramic Technology.

Advanced Precision Etched Ceramic Substrates

TTM's state-of-the-art Advanced Precision Etched Ceramic Substrate ("APECS") technology provides precision ceramic substrate requirements without the expense of thin film ceramics.

Why TTM is a Trusted Supplier of Thick-Film Substrates

TTM's precision thick-film technology utilizes traditional thin-film technology; we can meet or exceed thin-film tolerances and at a more affordable price.

The APECS process lends itself to higher-frequency, higher-power density trends seen throughout today's RF and microwave applications. As frequencies increase, so does the importance of line-width and spacing tolerances along with keeping losses to a minimum. APECS offers both compared to competing technologies.

The APECS process combined with standard thick-film technology yields cost-effective, highly integrated multi-layer circuits. APECS substrates enable component integration (resistors, inductors, and capacitors) rather than applying discrete components using traditional component mounting.

A range of material choices is available with the APECS process, including:

  • Ground plane metallization: Au, Pd/Au, Ag/Pd, Ag
  • Photo-imaged and etched conductors and RF circuits: Au
  • Dielectric and photo-imaged dielectric
  • Mixed-metal multi-layer circuits
  • Standard thick-film substrates: 96%, 99.5%, and 99.6% alumina, aluminum nitride and BeO, quartz and fused silica, and ferrites

TTM offers enormous design flexibility in terms of materials, circuit layout, embedded or non-embedded components, manufacturing techniques, and more.

  • Sequentially applied layers of alternating conductor and dielectric to build up the multi-layer structure, affording you from one to eight conductor layers per side (single- or double-sided)
  • Multiple sizes available starting at 0.020 x 0.020"
  • Advanced laser machining capability for various shapes and cut-outs
  • Wide resistance ranges from 0.2Ω to 50 GΩ
  • Multiple termination materials, including Au, PdAu, Ag, PdAg
  • Tin lead or Au plating available
  • RF attenuators also available up to 18 GHz
  • Integrated passives including resistors, capacitors, and inductors
  • Available on alumina, aluminum nitride, BeO, ferrite, and more for a wide range of wire bonding, soldering, and brazing
  • Choose edge wraps, metalized via fills, or both
We provide turnkey thick film solutions.

Turnkey Thick Film Solutions

We provide turnkey thick film solutions up to 80 GHz employing a wide range of material choices, design options, processes, and manufacturing techniques. Our range of thick-film applications experience includes:

  • Multi-layer circuit boards
  • Multi-chip assemblies
  • Patch antennas
  • Spiral inductors
  • Filters
  • Diode mounts
  • Distribution boards
  • Couplers
  • Circuit boards with integrated passives

Related Resources

Design Guideline
Etched Thick Film Ceramics Design Guide
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