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High-Density Interconnect (HDI) PCB

Enabling More Complex Interconnections for Advanced Technology Applications.

High Performance, High-Density Solutions for Advanced Applications

HDI PCBs have high-density attributes, including laser microvias, sequential lamination structures, fine lines, and high-performance thin materials. This increased density enables more functions per unit area. Advanced technology HDI PCBs have multiple layers of copper-filled stacked microvias, which creates a structure that allows even more complex interconnections. These complex structures provide the necessary routing and signal integrity solutions for today's large pin-count, fine pitch, and high-speed chips in high technology products.

Discover Our Family of Microvia Technologies

  • Create routing density (eliminate through vias)
  • Reduce layer count
  • Enhance electrical characteristics
  • Standard microvias connecting layers 1- 2, 1-3, up to 1-4


  • Allow increased routing on multiple layers
  • Provide routing solutions for next-generation applications
    1 mm - 0.8 mm - 0.65 mm - 0.5 mm - 0.4 mm - 0.3 mm & 0.25 mm
  • Provide a thermal management solution
  • Improve current carrying capability
  • Provide a planar surface for ball grid array ("BGA") (Via-in-Pad) eliminating potential solder voiding
  • Allow any-layer via technology


  • Provide additional dielectric material & small geometry features
  • Improve impedance performance
  • Provide RF microvia solutions
  • Provide a solid copper plate
  • Improve current carrying capability & thermal management
  • Provide a planar surface for BGA (Via-in-Pad)


  • Provide additional dielectric for RF applications
  • Maintain small geometries on multiple layers
  • Improve signal integrity
  • Provide a solid copper plate
  • Improve current carrying capability & thermal management
  • Provide a planar surface for BGA (via-in-pad)


Conventional 1-3 Skip Via

More About High-Density Interconnect (HDI) PCB Technology

HDI PCBs capitalize on the latest technologies available to increase the functionality, enabling the use of finer pitch and improving PCB signal integrity using the same or less area. This advancement in PCB technology supports advanced features in revolutionary new products, including 5G communications, networking equipment, IoT, wearables for medical patient monitoring, PCBs for autonomous applications, LiDAR systems, vehicle-to-everything (“V2X”) communications, and military applications such as satellites, avionics, and intelligent munitions.

Advanced Capabilities: Microvias

A laser-drilled microvia has a drilled diameter as small as 0.004" (100µm), which is optically aligned in a pad diameter as small as 0.008" (200µm), allowing additional routing density. Microvias can be via-in-pad (for direct component mounting), offset, staggered or stacked, non-conductive filled, and copper-plated over the top or solid copper filled or plated. Microvias add values when routing out of fine pitch BGA such as 0.8 mm pitch devices and below.

Additionally, microvias add values when routing out of a 0.5 mm pitch device where staggered microvias can be used. However, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device requires stacked microvias using an inverted pyramid routing technique.

TTM has years of experience with HDI products and was a pioneer of second-generation microvias or stacked microvias. Stacked microvia technology with solid copper stacked microvias enables rout-out solutions for very high speed and micro BGA.

TTM offers an entire family of microvia technology solutions for your next-generation products.

NextGen-SMV Technology

TTM developed and now offers third generation microvias or NextGen-SMV®, which offers stacked microvia fabrication on time (5-7 days). NextGen-SMV® technology allows for a quick turn of PCB designs with complex via structures. It requires only one lamination cycle reducing thermal excursions (thermal degrading of material) and cycle time.

NextGen-SMV® eliminates the copper plating cycle of inner layers, improving impedance tolerance, reducing overall thickness, and improving electrical characteristics. Additionally, NextGen-SMV® provides designer flexibility to have any-layer-via connectivity using a metallurgical bond between conductive paste and copper on the inner layers. SMV® technology can also be utilized with NextGen-SMV for the surface or external microvias to create a solid copper via if required.

Additionally, NextGen Sub-Link Technology® allows the interconnecting of multiple subs containing high technology or standard technology. This technology allows the use of high-performance materials only where they are needed or required.


It's the solution for networking, high-end server, telecommunications, military, and medical markets – anyplace where speed, reliability, and increased signal I/O must combine with reduced size, weight, and power ("SWaP").

  • 25 microns line and space
  • RAD tolerant
  • High-speed

Find out more about substrate-like PCB.

CoreEZ® semiconductor packaging

CoreEZ® semiconductor packaging uses the HyperBGA® manufacturing platform. It is an excellent choice for applications requiring low-cost build-up materials and high reliability, performance, and wireability.

  • 28 microns line and space
  • RAD Hard
  • Tight registration build-up technology

Find out more about substrate-like PCB.

Relevant Pages

Relevant Pages

Flex/ Rigid-Flex PCB

RF and Microwave PCB

Thermal Management

Substrate-Like (SLP) PCB

Relevant Resources

High-Density Interconnect (HDI) Technology (English)
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