TTM Offers Critical PCB Technologies to Support Computing Applications
More Capabilities to Support Advanced Computing
In addition to the above, TTM provides full lifecycle support and broad offerings of printed circuit board, RF/microwave, and engineered solutions for our customers in both commercial and non-commercial industries. Other examples of capabilities we offer to support our high-end computing customers include:
- Lead-free manufacturing
- Ultra-high aspect ratio
- Via fill
- 50+ layers
- RF and Specialty components
- Seamless transfer from prototype to volume production
Locations that Support Your Innovative Applications
- HDI
- Sequential
- Hybrid structures
- Multiple surface finishes
- High-layer count designs
- Laser microvias
- Advanced materials
- High-volume 2.0 core material