TTM Has Deep Expertise and Capabilities to Offer Leading-Edge Solutions for Innovative Industrial Applications
One-Stop Solution, Full Lifecycle Support
Global leaders in industrial and instrumentation markets trust TTM for ultra quick-turn and quick-turn offerings that ramp seamlessly to volume. Our dedicated field applications and production engineers can help get your prototype production-ready. We do validation and testing early on to ensure your ramp to volume is easy to achieve, saving you time to market.
TTM can accommodate various needs for medium and high-volume manufacturing through our global footprint of printed circuit board fabrication facilities, R&D centers, and a global team of field applications engineers. We provide differentiated solutions at any point in the product lifecycle. We can offer more options to ensure our customers are fully supported every step of the way.
TTM supports industrial & instrumentation applications at facilities in North America and Asia. We offer multi-site solutions and have material stocking strategies to mitigate risk for our customers, no matter what macro-economic factors come into play. TTM subscribes to several quality management certification bodies and strict environmental, health, and safety protocols to ensure we're leading the industry as a trusted supplier and an excellent employer.
Broad Technology Solutions Offerings
TTM takes pride in our continuous development of solutions that meet our customers' needs. From HDI to rigid-flex to RF components and substrate-like PCBs, TTM has a suite of advanced technologies to bring the most innovative electronics applications to life. TTM's differentiated capabilities make us a strategic partner for teams looking for an advantage in an increasingly competitive marketplace.
Advanced Technology Printed Circuit Boards ("PCB"s)
- Laser microvias
- High-Density Interconnect ("HDI")
- Via-In-Pad-Plated-Over ("VIPPO")
- Flex, Rigid-Flex
- High layer count
- Large format
- Hybrid materials
Thermal Management Solutions
Heavy Copper
Thermal management is essential to maintaining component temperature within designed values by removing excess generated heat.
Thermal Vias
Thermal dissipation has dramatically increased due to higher frequencies, increased data rates, and high current required by inverters and motor drives used in solar applications. Compounded by increased component density, all require advanced thermal management techniques to provide reliable products and extended product life.
Find more thermal management solutions in our Solutions section.
RF/Microwave Expertise & Capabilities
TTM has an array of off-the-shelf and custom solutions to enable mm-Wave-reliant applications. We have vigorously tested industry-leading solutions for diverse end markets. We recommend you visit our RF and Specialty Components pages in the Solutions section for complete details.
Plant Capabilities in TTM
TTM Guangzhou ("GZ") is best suited for advanced technology multi-layer PCB in volume application.
- High layer count
- Conventional and advanced HDI
- Oversized line card and backplanes
- Hybrid & sequential structures
- Thermal management
TTM Huiyang ("HY") is specializes in quick-turn, low-to-mid-volume production, with a specific focus on medium-to-high-technology products.
- High-Density Interconnect (type 1, 2,3)
- Radar
- Hybrid
- Flat wrap
- Copper fill
- No conductive fill
- VIPPO
- Backdrill
- LDI
- Optical routing
- ENEPIG
- Edge plating
- TMS
- IST and capacitance
TTM Penang ("PNG") is our highly advanced technology-equipped facility in Southeast Asia.
- HDI
- Highly Automated Production Lines
- Multi-layered Printed Circuit Board
- Greenfield Facility
TTM San Jose ("SJ") is a leader in Ultra-Fast Quick-turn PCBs on Advanced High-Density Interconnect Product.
- Ultra quick-turn, high-mix, low volume
- Radar with hybrid materials, tight etching, plating controls
- LiDAR utilizing vision drilling and routing
- High layer count requiring high-performance materials, controlled impedance, back-drilling, VIPPO, etc.
- Seamless transfer to Asia volume production
- Diverse laminate materials
TTM Toronto ("TOR") delivers quick-turn and ramps to low- and mid-volume under one roof.
- Quick-turn, high-mix, low- to mid-volume
- Radar and LiDAR development
- Material development; polyphenylene oxide ("PPO"), teflon
- Flex, rigid-flex
- Advanced HDI, including 3+n+3
- High layer count requiring high-performance materials, controlled impedance, back-drilling, high aspect ratio plating, VIPPO, etc.
- Seamless transfer to volume production in Asia
- Diverse laminate materials from North America and Asia Pacific
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